| 摘要 |
There is provided a semiconductor device manufacturing method having a ferroelectric or high-dielectric capacitor, which comprises the steps of forming an underlying insulating film over a semiconductor substrate, forming a first conductive film on the underlying insulating film, forming a dielectric film consisting of ferroelectric material and high-dielectric material on the first conductive film, forming a second conductive film on the dielectric film, etching selectively the second conductive film in a first atmosphere containing a bromine to form a capacitor upper electrode, etching selectively the dielectric film in a second atmosphere containing a chlorine to form a capacitor dielectric film, and etching selectively the first conductive film in a third atmosphere containing the bromine to form a capacitor lower electrode.
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