| 摘要 |
The manufacturing method of the semiconductor device provides reduction of the photoresist film distortion occurred in a development procedure and, as a result, makes measurement of the place difference of the photoresist mask correct. The manufacturing method of the semiconductor device to be published are those the photoresist film consisting the upper alignment-measuring mark is placed more than about 200 mum from an corner in device forming region formed adjoining scribing region, along with X-direction which is the measurement direction in scribing region formed on semiconductor substrate.
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