| 摘要 |
A semiconductor element mounting method is provided with high productivity. The method includes forming bumps on electrodes of a wafer in which a plurality of semiconductor elements have been formed, temporarily compression-bonding the wafer and an interposer via an insulative resin, curing the resin by heating and pressurization so that the wafer and the interposer are finally compression-bonded, where the electrodes of the wafer and electrodes of the interposer are bonded to each other, respectively, and where insulative resin overflowing from between the wafer and the interposer flows into grooves disposed so as to be coincident with dicing lines of the wafer, thus giving a uniform flow of the insulative resin, and thereafter, cutting and separating into individual semiconductor elements.
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