| 摘要 |
An enclosure for electronic components has a chassis, a cover mountable to the chassis, and a face plate mountable to the chassis/cover sub-assembly. The top side of the cover has a generally U-shaped groove running along three sides to receive a friction-fitted gasket that forms a portion of the environmental seal for the enclosure. Each end of the groove has a J-shaped portion within which the gasket loops back on itself. The bottom of each J-shaped portion is open on the cover's front side, such that the side of the gasket will protrude beyond the front side of the chassis/cover sub-assembly, thereby providing a portion of the seal when the face plate is mounted onto the chassis/cover sub-assembly. The J-shaped portions account for contraction of the gasket due to strain relief after the gasket is placed in the groove and provide increased frictional force that further inhibits such strain relief.
|
