| 摘要 |
PURPOSE: A wafer probing apparatus and a method for correcting a wafer testing needle are to contact with the wafer testing needle one by one and to exactly correct a signal applied to the needle. CONSTITUTION: A wafer probing apparatus comprises a needle chuck(121) contacted with a number of needles, a camera(151) catching a position of the needle, a moving member for moving a needle chuck(171) by receiving a data on the position of the needle from the camera, and a base(131) moving the needle chuck, the camera, and the moving member. The needle chuck includes a signal cable having a conductivity, and a shield enclosing the signal cable. The moving member includes a needle chuck base(173) for maintaining the needle chuck, a vertical rail(175) for moving the needle chuck base, a motor(179) for rotating the vertical rail, and a needle chuck controller(177) controlling the motor.
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