BUILT-UP PCB AND FABRICATING PROCESS THEREOF

摘要

PURPOSE: A built-up PCB(Printed Circuit Board) and a fabricating process thereof are provided to achieve the high density circuits by forming symmetric blind via holes. CONSTITUTION: A copper foil(11) is removed from an upper end of the first copper stack plate(1) by a window opening process. The first blind via hole(6) is formed on the first copper stack plate(1). A copper plating layer(12) is formed on an inner wall of the first blind via hole(6). A circuit and a land(5) are formed at an upper end and a lower end of the first copper stack plate(1). The second copper stack plate(4) is stacked on the first copper stack plate(1) after turning over the first copper stack plate(1). The copper foil(11) is removed from an upper end of the second copper stack plate(4) by the window opening process. The second blind via hole(9) is formed on the second copper stack plate(4). The copper plating layer(12) is formed on an inner wall of the second blind via hole(9). The circuit is formed by removing the copper foil from the second copper stack plate(4).