Method for spin coating high viscosity materials on silicon wafers

摘要

A method for spin coating high viscosity materials. Two dispense steps are used. The first dispense step dispenses a small amount (102) of high viscosity material at the center of the wafer (100). A high-speed wafer rotation spreads the material to form a thin layer (104) to prime the surface of the wafer (100) and lower the surface tension without regard to uniformity. A second dispense step occurs at lower RPM and coats (108) the wafer (100) more uniformly.