发明名称 Heat sink for cooling an electronic component of a computer
摘要 The heat sink is described which is used to cool an electronic component of a computer. The heat sink is constructed from a metal sheet which is bent so as to have a horizontal thermally conductive plate and four walls extending upwardly from the plate and jointly define an enclosure. Openings are formed in the walls through which air can flow by natural convection.
申请公布号 US6614657(B2) 申请公布日期 2003.09.02
申请号 US20010931783 申请日期 2001.08.16
申请人 INTEL CORPORATION 发明人 SEARLS DAMION T.;DISHONGH TERRANCE J.;JACKSON JAMES D.
分类号 G06F1/20;H01L23/367;(IPC1-7):H05K7/20 主分类号 G06F1/20
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