| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold assembly for molding a resin product capable of integrally bonding a resin film to the resin product up to the outside surface of the bead edge part thereof. SOLUTION: The resin film 4 is drawn out to the front of the molding surface 11 of a movable mold (cavity mold) 1 to be clamped to the molding surface 11 and, after the resin film 4 is subsequently sucked to the molding surface 11, the movable mold (cavity mold) 1 is allowed to advance to perform mold clamping and a molten resin R is injected in the cavity 5 formed by mold clamping through a runner 22. A slide mold 3 is allowed to retreat after the molten resin R is solidified and the movable mold (cavity mold) 1 is allowed to further retreat to take out a product having the resin film bonded thereto up to the outside surface of the bead edge part thereof. COPYRIGHT: (C)2003,JPO |
