| 摘要 |
PURPOSE: A multi chip package is provided to form a thin film type multi chip package capable of being adapted to a fine pitch product by eliminating the need to extend an inner lead. CONSTITUTION: A die pad(21) is prepared to mount a chip. A plurality of inner leads(23) are formed in the vicinity of the die pad. The first semiconductor chip(11) is mounted on the die pad. The second and third semiconductor chips(13,15) are mounted on both sides of the first semiconductor chip, overlapping the die pad and the inner leads. A bonding wire(41) electrically connects the semiconductor chips and each semiconductor chip with their corresponding inner leads. |
