METHOD FOR FABRICATING REPAIRING AND REBALLING BALL GRID ARRAY PACKAGE

摘要

PURPOSE: A method for fabricating repairing and reballing a ball grid array(BGA) package is provided to improve the quality of a package module by effectively performing a repairing process on the BGA package, and to reduce fabricating cost by recycling a used BGA package through a reballing method. CONSTITUTION: The package module is baked(41). A defective package is separated from the board(42). The residual solder ball on the board is eliminated through a dressing process and a cleaning process(43). A good quality package is temporarily attached to the cleaned board by using the heat applied form a vacuum nozzle(44). The good quality package is permanently attached to the board through a reflow process(45).