| 摘要 |
PROBLEM TO BE SOLVED: To prevent formation of an oxide film and increase drying efficiency. SOLUTION: A wafer drying device 100 is constituted of a chamber 110, an air distributor 130, a liquid flowing system, and a decompressing means. The liquid flowing system includes a distributing pipe 142 which has a number of injection holes 144 formed therein as a means for supplying liquid into a treatment bath 112 in a connecting manner, first and second drain pipes (152a, 152b) which are connected to a discharge pot 113 of the treatment bath 112 as a discharging means, and control valves 154 provided on the drain pipes, respectively. The decompressing means is constituted of a discharge pot 162 formed on a cover 114, a vacuum exhaust pipe 164 connected to the discharge pot 162, and an ON/OFF valve 166 for opening and closing the vacuum exhaust pipe 164. Before IPA is supplied, the decompressing means decompresses the inside of the chamber to remove air from the inside of the chamber 110 (substantially to remove oxygen). COPYRIGHT: (C)2003,JPO
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