发明名称 SOLID-STATE IMAGE PICKUP DEVICE, METHOD FOR CONVERTING FAILED PIXEL FOR THE APPARATUS AND DEFECT CORRECTING METHOD
摘要 PROBLEM TO BE SOLVED: To easily correct defects in product assembly. SOLUTION: A solid-state image pickup device can switch connections of the drain of a reset transistor 2 to a reference potential VDD or a ground potential and apply a voltage higher than the rated voltage transistor to the drain of an amplifying transistor 4. Accordingly, when black defects in brightness by testing in a wafer state, the device applies a high level to the gate of the transistor 2, connects the drain of the transistor 2 to the ground potential and sets the gate potential of the transistor 4 to a low level, and applies a voltage higher than the rated voltage of transistor to the drain of the transistor 4, to make a short circuit between the drain and the gate. Accordingly, pixel cells with operation failures of the black defects in the brightness are converted into pixel cells equal to white defects in darkness, where an electrical charge area is always fixed to a power supply potential, without depending on incident light. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003244547(A) 申请公布日期 2003.08.29
申请号 JP20020035940 申请日期 2002.02.13
申请人 SHARP CORP 发明人 KOYAMA HIDETSUGU
分类号 H01L27/146;H04N5/335;H04N5/367;H04N5/374;(IPC1-7):H04N5/335 主分类号 H01L27/146
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