TAPE WITH ADHESIVE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a tape with an adhesive easily to be manufactured and a method of efficiently manufacturing the same.

SOLUTION: In a tape with an adhesive for semiconductor device comprising at least an adhesive layer laminated on a flexible organic insulation film, a plurality of adhesive layers are provided on the insulation film in an MD direction such that they do not contact with each other.

COPYRIGHT: (C)2003,JPO