| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thermal stress impingement plate, a chip type semiconductor device in which the strength of soldering with an external electrode is secured by stabilizing the bonding of a heat impingement plate by an Al-Si alloy, and a manufacturing method therefor. <P>SOLUTION: On one side of the thermal stress impingement plate like W or Mo, a laminate film composed of a Ti film is formed on the first layer thereof and a laminate film composed of an Ni film is formed on the second layer thereof. Then, on the opposite side, an Al film or an Al-Si alloy film is formed on the first layer thereof and a laminate film composed of an Ag film is formed on the second layer thereof respectively by electron vacuum deposition or sputtering. In such a structure, in the manufacturing method, the semiconductor device formed with the Al film or the Al-Si alloy film and the thermal stress impingement plate are bonded through an Al-Si alloy plate to a main electrode. <P>COPYRIGHT: (C)2003,JPO</p> |
