发明名称 THIN FILM ENCAPSULATION OF MEMS DEVICES
摘要 A method of manufacturing a miniature electromechanical system (MEMS) device includes the steps of forming a moving member on a first substrate such that a first sacrificial layer is disposed between the moving member and the substrate, encapsulating the moving member, including the first sacrificial layer, with a second sacrificial layer, coating the encapsulating second sacrificial layer with a first film formed of a material that establishes an hermetic seal with the substrate, and removing the first and second sacrificial layers.
申请公布号 WO03070625(A2) 申请公布日期 2003.08.28
申请号 WO2003US04503 申请日期 2003.02.19
申请人 NORTHROP GRUMMAN CORPORATION;FREIDHOFF, CARL, B. 发明人 FREIDHOFF, CARL, B.
分类号 B81C1/00;B81B3/00;B81B7/00;B81B7/02 主分类号 B81C1/00
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