| 摘要 |
A heatsink device for cooling a chipset is provided. The heatsink device for cooling a chipset mounted on a printed circuit board to interface a central processing unit with a peripheral device, the printed circuit board including a plurality of installation holes near the chipset, the heatsink device including: a heatsink mounted to contact the top surface of the chipset to externally dissipate heat generated by the chipset, the heatsink having a pair of parallel guide grooves at the bottom edge regions which do not contact the chipset; and an installation unit which is fixed to be movable in each of the guide grooves and is connected to one installation hole of the printed circuit board, to bring the heatsink in contact with the top surface of the heatsink. The installation unit, which binds the heatsink to a chipset, is fixed to a bottom edge region to be movable along the bottom edge of the heatsink, so that the heatsink can be mounted on any printed circuit board having installation holes at a variety of different positions by adjusting the position of the installation unit to the position of the corresponding installation hole. The installation unit includes a spring to elastically push the heatsink toward the chipset and to absorb external vibrations or impacts, so that the chipset can be protected from external vibrations or impacts.
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