| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper foil for resin bonding by which a homogeneous roughening copper-plating film can be formed independently of the presence of ruggedness and adhering matter on the surface of a copper-foil material and also to provide its manufacturing method. SOLUTION: This copper foil for resin bonding can be manufactured by applying an amorphous metal plating film 3A of 0.01 to 1μm average thickness at least one or more times to the surface of the copper-foil material 1 of electrolytic copper foil or rolled copper foil and then forming the roughening copper- plating film 2 of 1 to 20μm thickness on the above. By interposing the amorphous metal plating film 3A as an intermediate metal film on the surface of the copper-foil material 1, the influence of recessed parts 1a, projecting parts 1b, metallic crystal orientations 1c, adhering oxides, etc., on the surface of the copper-foil material 1 upon the nucleation of the roughening copper-plating film 2 and subsequent film growth can be intercepted nearly perfectly and the homogeneous roughening copper-plating film 2 can be formed. COPYRIGHT: (C)2003,JPO
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