发明名称 HOT-MELT ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a hot-melt adhesive composition with reduced stringiness. SOLUTION: There is incorporated 0.05-5 pts.wt. of polyethylene (V) to 100 pts.wt. of a composition comprising (I) 3-57 wt.% of an ethylene-unsaturated ester copolymer having a content of the unsaturated ester of 5-30 wt.%, (II) 3-57 wt.% of an ethylene-unsaturated ester copolymer having a content of the unsaturated ester higher than that of the ethylene-unsaturated copolymer of (I) by 10 wt.% or more, (III) 15-60 wt.% of an adhesion imparting agent, and (IV) 5-40 wt.% of wax. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003238920(A) 申请公布日期 2003.08.27
申请号 JP20020043822 申请日期 2002.02.20
申请人 TOSOH CORP 发明人 SAKANO HIROHIDE;YUKIOKA SATOSHI
分类号 C09J123/08;C09J123/06;C09J131/00;C09J131/04;C09J133/04;C09J157/02;C09J191/06;(IPC1-7):C09J123/08 主分类号 C09J123/08
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