| 摘要 |
PROBLEM TO BE SOLVED: To obtain a polyamide resin composition which gives a molded article excellent in coating film adhesion, surface appearance, impact resistance, dimensional stability, heat resistance, electric conductivity, and residence stability. SOLUTION: This resin composition comprises (A) 35-80 wt.% polyamide resin, (B) 5-35 wt.% impact modifier, (C) 5-30 wt.% filler having an average particle size of 0.5-10μm, (D) 3-40 wt.% conductivity-imparting agent, and (E) 0.1-10 wt.% epoxy compound having a number average mol.wt. of 10,000 or lower. When the total weight of the composition is regarded as 1, the quotient (weight/epoxy equivalent) obtained by dividing the weight of the epoxy compound (E) by its epoxy equivalent is 1.5×10<SP>-5</SP>-5×10<SP>-5</SP>. COPYRIGHT: (C)2003,JPO
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