发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 <p>A semiconductor device includes a first-conductivity-type semiconductor substrate (101), a second-conductivity-type source layer (102) formed in a surface in the semiconductor substrate (101), a second-conductivity-type drain layer (103) formed in the surface in the semiconductor substrate (101) to oppose the source layer (102) with a predetermined interval, a gate insulating film (104) formed on the semiconductor substrate (101), a gate layer (105) formed on the gate insulating film (104) between the source layer (102) and drain layer (103), source electrodes (108) formed on the semiconductor substrate (101) and electrically connected to the source layer (102), a drain electrode (109) formed on the semiconductor substrate (101) and electrically connected to the drain layer (103), a gate electrode (107) formed on the semiconductor substrate (101) and electrically connected to the gate layer (105), and a capacitance adjusting electrode (114) formed on the gate insulating film (104). &lt;IMAGE&gt;</p>
申请公布号 EP1339106(A1) 申请公布日期 2003.08.27
申请号 EP20010978889 申请日期 2001.10.24
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 KIKUCHI, KOUJI
分类号 H01L21/822;H01L27/04;H01L29/10;H01L29/417;H01L29/423;H01L29/78;(IPC1-7):H01L29/78;H01L27/06;H01L27/088;H01L21/823;H01L21/336 主分类号 H01L21/822
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