发明名称 MOLD OF HOLDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a mold of a molding device which can change a position for ejecting an ejector pin from a movable half of a mold to the cavity side. SOLUTION: The mold of a molding device is equipped with regularly disposed numerous through holes 37, for supporting the ejector pin 36 in a freely attachable/detachable manner. As the ejector pin 36 can be supported by an appropriate supporting means complying with a molded product, it is possible to change a position where the ejector pin 36 can be ejected into a cavity. A general-purpose plate 22 and the ejector pin 36 are set free from a fifth plate 22 and a sixth plate 24 by removing a screw for fixing the general-purpose plate 22 to the sixth plate 24. Consequently, the general-purpose plate 22 and the ejector pin 36 can be taken out by passing them through an opening part 39 of a fourth plate 20 and an opening part of a third plate 16. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003236850(A) 申请公布日期 2003.08.26
申请号 JP20020041266 申请日期 2002.02.19
申请人 SEIKO EPSON CORP 发明人 OGAWA YASUSHI
分类号 B29C33/44;B29C45/40;(IPC1-7):B29C33/44 主分类号 B29C33/44
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