发明名称 METHOD OF MANUFACTURING RESISTANCE LAYER LAMINATED MEMBER AND METHOD OF MANUFACTURING COMPONENT USING RESISTANCE LAYER LAMINATED MEMBER
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a resistance layer laminated member and a method of manufacturing a component using the resistance layer laminated member in which a resistor having a prescribed resistance is formed in a wiring pattern formed by etching. SOLUTION: The resistance layer laminated member 22 is manufactured, in which the resistor having the prescribed resistance is formed in the wiring pattern by laminating three or more layers of conductive layers 24 having an excellent conductivity and resistor layers 28 having a prescribed specific resistance, activating the respective joined faces at at least a joined plane and laminating and joining the layers in such a manner that the activated faces are butted opposing to each other. Further, components applied for a printed circuit board, an IC package or the like are manufactured by using the resistance layer laminated member 22. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003236679(A) 申请公布日期 2003.08.26
申请号 JP20020039548 申请日期 2002.02.18
申请人 TOYO KOHAN CO LTD 发明人 SAIJO KINJI;YOSHIDA KAZUO;OSAWA SHINJI
分类号 B23K20/04;B23K20/14;B23K20/24;B23K101/36;H05K1/16;(IPC1-7):B23K20/04 主分类号 B23K20/04
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