发明名称 |
Electolytic copper foil with carrier foil and method for manufacturing the same |
摘要 |
The present invention provides electrodeposited copper foil with carrier which has an organic adhesive interface layer permitting control of the lower limit of peel strength between a carrier foil and an electrodeposited copper foil and to a method for producing the electrodeposited copper foil with carrier. In the electrodeposited copper foil with carrier including a carrier foil, an adhesive interface layer formed on the carrier foil, and an electrodeposited copper foil formed on the adhesive interface layer, the carrier foil is formed of a copper foil and the adhesive interface layer contains an organic agent and metallic particles, the organic agent and the metallic particles being in an intermingled state.
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申请公布号 |
US6610418(B1) |
申请公布日期 |
2003.08.26 |
申请号 |
US20010031279 |
申请日期 |
2001.11.07 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
YOSHIOKA JUNSHI;SUGIMOTO AKIKO;DOBASHI MAKOTO;IWAKIRI KEN-ICHIRO;HIRASAWA YUTAKA |
分类号 |
C25C1/12;C25D1/04;C25D1/22;C25D7/06;C25D9/02;H05K1/09;H05K3/02;H05K3/38;(IPC1-7):B32B15/08 |
主分类号 |
C25C1/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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