Method for manufacturing nitride compound based semiconductor device using an RIE to clean a GaN-based layer

摘要

A method for manufacturing a GaN-based semiconductor device in which an ohmic contact can be provided between the semiconductor layer and the electrode material. In a method for manufacturing wherein an n-GaN layer, an emissive layer, a p-GaN layer are formed on a substrate in that order; etching is performed to expose a portion of the n-GaN layer; and a negative electrode is formed on the n-GaN layer, the etching is performed in two sub-steps, an etching step using BCl3 gas and an etching step using Cl2 gas. The surface of the n-GaN layer is exposed in the first sub-step and the B (boron) contamination layer is removed in the second sub-step.