| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To achieve downsizing and slimming a frame by reducing the area necessary for mounting IC chips other than a display part, and also to reduce connection failure of signal lines associated with mounting the IC chips in an active matrix type display device. <P>SOLUTION: In the active matrix type display device, TFTs are formed on a counter substrate to form a desired logic circuit, and thereby the logic circuit that was conventionally packaged externally can be formed on the counter substrate. Moreover, speeding up and higher performance of the active matrix type display device are realized by optimizing the pixels or driving circuits on the pixel substrate and the logic circuit on the counter substrate in the constitution of TFTs and the power supply voltage, respectively. <P>COPYRIGHT: (C)2003,JPO</p> |
