| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board and a method of manufacturing the same which is capable of preventing corrosion of vias. SOLUTION: The wiring board 100 is a multilayer wiring board which consists of multilayer sections 1 and 2, and a core section 3. The multilayer section 1 is formed with vias 71, having a bottom with the core section 3 being the bottom, while the multilayer section 2 is formed with vias 72, having a bottom with the core section 3 being a bottom. The wiring board 100 is formed with a through-via 6. Each conductor layer is properly patterned. In the wiring board 100, a plating layer on the wall faces of the vias 71 and 72 having a bottom is formed by Au which is an anti-corrosive metal. Therefore, even if a liquid sticks to the inside of the vias from cleaning or the like, the plating layer will hardly corrode. COPYRIGHT: (C)2003,JPO |
