| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board which is a high-density and reliable laminate, wherein an insulating adhesive layer with interlayer connection holes being filled with a conductive paste and a conductor pattern formed of a metal foil are alternately disposed, with at least two layers of the conductor patterns electrically connected via the conductive paste under heat and pressure. SOLUTION: The holes for interlayer connection, formed in the insulating adhesive layer having the metal foil on one face, are filled with the conductive paste so that the height of the conductive paste is within±10μm, with respect to the depth of the holes. A circuit board is laid on top of a face of the insulating adhesive layer filled with the conductive paste which is disposed on a side opposite from the metal foil side, with the holes for interlayer connection and a circuit of the circuit board being aligned with each other, and then electrical connection is made among the layers subjected to heating and pressuring to fabricate the multilayer printed wiring board. COPYRIGHT: (C)2003,JPO |
