| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board provided with an embedded type outer layer conductive of a very thin and very fine line width. SOLUTION: A board comprises an outer layer conductor embedded in a dielectric layer, the dielectric layer and a three-plane adhesion connecting part. In a template embedding precise transfer pattern (TIPTOP) process, a conductor is formed on a smooth separate type template by metallizing or optical die cutting, pattern electrical plating system. A circuit pattern is transferred to the dielectric layer by using a jointing method through pressurization, and then a metal foil covering the surface is removed, to manufacture the printed circuit board. COPYRIGHT: (C)2003,JPO |
