发明名称 LAMINATED CHIP COMPONENT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To reduce the variation of the progress of development at the time of manufacturing a laminated chip component by using a photolithographic method. SOLUTION: On a substrate 24, marks 28 for confirming the progress of development including disappearing confirmation areas 28c and 28d which disappear when the progress of development becomes a standard progress and remaining confirmation areas 28a and 28b which remain when the progress of development becomes the standard progress. Consequently, it can be discriminated that the progress of development falls within the range of the standard progress when only the areas 28c (and 28d) disappear, and that the development is insufficient when the areas 28c (and 28d) remain (Fig. 3 (c)). When the remaining confirmation areas 28b (and 28a) disappear (Fig. 3 (d)), the development can be discriminated as overdevelopment. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003234232(A) 申请公布日期 2003.08.22
申请号 JP20020034559 申请日期 2002.02.12
申请人 MURATA MFG CO LTD 发明人 SUGIYAMA YUJI;YASO TORU
分类号 G03F7/30;H01F17/00;H01F41/04;(IPC1-7):H01F41/04 主分类号 G03F7/30
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