发明名称 |
Bump manufacturing method |
摘要 |
A method of forming bumps on the active surface of a silicon wafer. An under-ball metallic layer is formed over the active surface of the wafer. A plurality of first solder blocks is attached to the upper surface of the under-ball metallic layer. Each first solder block has an upper surface and a lower surface. The lower surface of each first solder block bonds with the under-ball metallic layer. The upper surfaces of the first solder blocks are planarized. A second solder block is attached to the upper surface of each first solder block and then a reflux operation is carried out. |
申请公布号 |
US2003155406(A1) |
申请公布日期 |
2003.08.21 |
申请号 |
US20020063573 |
申请日期 |
2002.05.03 |
申请人 |
TONG HO-MING;LEE CHUN-CHI;FANG JEN-KUANG;HUANG MIN-LUNG;CHEN JAU-SHOUNG;SU CHING-HUEI;WENG CHAO-FU;LEE YUNG-CHI |
发明人 |
TONG HO-MING;LEE CHUN-CHI;FANG JEN-KUANG;HUANG MIN-LUNG;CHEN JAU-SHOUNG;SU CHING-HUEI;WENG CHAO-FU;LEE YUNG-CHI |
分类号 |
B23K1/00;(IPC1-7):B23K31/02;B23K35/12 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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