| 摘要 |
<p>A sub-mount enabling solder from climbing the edge of a semiconductor laser device and a semiconductor device are disclosed. A sub-mount for mounting a semiconductor device (2) thereon comprising a sub-mount substrate (4) and a solder film (8) formed on the sub-mount substrate (4), wherein the width WS (µm) and thickness d (µm) of the solder film are determined so that the following conditions may be satisfied. 0. 3≤d≤1 when W=-30 µm, 0. 3≤d≤(7×W/110+32/11) when -30 µm<W≤30 µm, (37×W/600-1.55)≤ d ≤(7×W/110+32/11) when 30 µm<W≤80 µm, and (37×W/600-1.55)≤ d ≤8 when 80 µm<W≤90 µm where WC is the width (µm) of the semiconductor device to be mounted on the solder film and W is an evaluation value (µm) defined by 2W=(WC-WS).</p> |
