PROCESS FOR INTRODUCING AN INSULATING SYSTEM IN AN INTERSPACE

摘要

It is described a process for inserting an insulating system comprising at least a vacuum insulating panel (20; 30) in a matrix of homogeneous polymeri c foam (602; 707), inside an interspace (101; 703) of a device which has to be subsequently subjected, at least at said interspace, to a temperature higher than 100 ~C, without damaging this system and without causing it to lose its original insulating properties by providing a flexible protection system of cardboard.