发明名称 |
Lead frame for a semiconductor device and a semiconductor device incorporating the lead frame |
摘要 |
A lead frame for a semiconductor device. The lead frame has opposite first and second sides bounded respectively by first and second parallel reference planes between which a thickness is defined. The lead frame has a support with a surface at the first side of the lead frame for receiving a semiconductor chip. A plurality of leads are spaced from the support to be electrically connected to a semiconductor chip on the support. A first lead in the plurality of leads has a length between first and second ends and a width taken transversely to the length. The first end of the first lead has a first region that has a thickness less than the thickness of the first lead at the second end of the first lead so that at least a part of the first region is offset from the second reference plane toward the first reference plane. The first end of the first lead has at least a first protrusion projecting away from the first reference plane. |
申请公布号 |
US2003155634(A1) |
申请公布日期 |
2003.08.21 |
申请号 |
US20020322900 |
申请日期 |
2002.12.18 |
申请人 |
MITSUI HIGH-TEC, INC. |
发明人 |
YASUNAGA SHOSHI;ISHIBASHI TAKAHIRO;NARIMATSU HIROAKI |
分类号 |
H01L23/50;H01L23/12;H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/50 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|