发明名称 Laser micromachining and methods and systems of same
摘要 The described embodiments relate to methods and systems for laser micromachining a substrate. One exemplary embodiment positions a substrate in an open air environment. The substrate has a thickness defined by opposing first and second surfaces. The substrate can be cut by directing a laser beam at the first surface of the substrate and introducing an assist gas proximate to a region of the substrate contacted by the laser beam.
申请公布号 US2003155328(A1) 申请公布日期 2003.08.21
申请号 US20020076467 申请日期 2002.02.15
申请人 HUTH MARK C.;POLLARD JEFFREY R.;SCOTT GRAEME 发明人 HUTH MARK C.;POLLARD JEFFREY R.;SCOTT GRAEME
分类号 B23K26/12;B23K26/14;B41J2/16;(IPC1-7):C23F1/00;B23K26/38 主分类号 B23K26/12
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