发明名称 |
Semiconductor build-up package |
摘要 |
A semiconductor build-up package includes a die, a circuit board and at least a dielectric layer. The circuit board has a surface for building up the dielectric layer, and the surface has a cavity for accommodating the die. The inside of multi-layer circuit board has conductive traces for expanding the electrical function of semiconductor build-up package. Each dielectric layer has conductive columns so that the die may electrically connect with the outermost dielectric layer. At least a conductive column is bonded on the surface of the multi-layer circuit board for inner electrical connection.
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申请公布号 |
US2003157747(A1) |
申请公布日期 |
2003.08.21 |
申请号 |
US20020075227 |
申请日期 |
2002.02.15 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
CHEN KUN-CHING;DING YI-CHUAN;OU IN-DE |
分类号 |
H01L21/44;H01L23/04;H01L23/34;H01L23/498;H01L23/538;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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