| 发明名称 |
Packaging of low application hot melt adhesive formulations |
| 摘要 |
Films having a melting point below about 100 C. are used to package low temperature hot melt adhesives. The packaging film does not require removal prior to use of the adhesive. The packaged adhesive is easy to handle and units are non-blocking |
| 申请公布号 |
US2003155261(A1) |
申请公布日期 |
2003.08.21 |
| 申请号 |
US20030375270 |
申请日期 |
2003.02.27 |
| 申请人 |
PAUL CHARLES W.;RODGERS ANTHONY P. |
发明人 |
PAUL CHARLES W.;RODGERS ANTHONY P. |
| 分类号 |
C09J201/00;B29B13/02;B65B63/08;C09J123/02;C09J123/08;(IPC1-7):B65D57/00 |
主分类号 |
C09J201/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
