| 摘要 |
<p>Optoelectronic packaging assemblies (50) for optically and electrically interfacing a protected elecrro-optical device or system to both an optical fiber and to external circuitry. Such assemblies comprise body components that are made of plastic which is coated or plated with a conductive material. Electrical contact pins (54) in the form of transmission lines are used to couple external electrical signals with the package. The optoelectronic packaging assemblies are dimensioned with small cavities and with steps, breaks, walls, and/or fins molded into the body components. The assemblies further include an optical input receptacle (64) for receiving an optical ferrule and an optical fiber. The packaging assembly provides for cooling, such as by heat sink fins (68) and/or a thermoelectric cooler. The transmission line pins and body components are dimensioned to mate with a standardized circuit board having transmission line traces.</p> |
