发明名称 Cooling method and apparatus
摘要 A method and apparatus for cooling an electronic component, such as an optoelectronic device, is described. The method involves arranging a porous material to be able to receive heat from the electronic component and removing heat from the porous material as a result of vaporization of a coolant delivered to the porous material. In this manner, a temperature gradient is generated that causes heat to flow from the electronic device to the porous material, resulting in the electronic device being cooled.
申请公布号 GB0316832(D0) 申请公布日期 2003.08.20
申请号 GB20030016832 申请日期 2003.07.17
申请人 ENFIS LIMITED 发明人
分类号 H01L23/373;H01L23/427;H01L33/64;H01S5/024 主分类号 H01L23/373
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