| 摘要 |
A resin coated conductor (RCC) structure 34', 35 having a stress relieving photosensitive layer 34' is formed over a stress relieving thermosetting insulating layer 34. Flexible contacts 38 may be formed using metallic powders or wirebonds. Arrangements are also described which only use a stress relieving layer on the RCC structure and without a stress relieving thermosetting layer formed directly on the substrate (figures 9A-C and 10A-C). Delamination of the flip-chip device mounted on a circuit board having a differing thermal expansion coefficient is reduced. |
