发明名称 LAYERED CIRCUIT BOARDS AND METHODS OF PRODUCTION THEREOF
摘要 Compositions and methods are provided whereby printed wiring boards may be produced that comprise a) a substrate layer, and b) a solid, substantially planar optical wave-guide laminated onto the substrate layer. The printed wiring board farther comprises at least one of a laminating material or a cladding material coupled to the wave-guide, and at least one additional layer coupled to the laminating material or the cladding material.
申请公布号 KR20030068173(A) 申请公布日期 2003.08.19
申请号 KR20037007786 申请日期 2003.06.11
申请人 发明人
分类号 G02B6/12;G02B6/122;G02B6/43;H05K1/02 主分类号 G02B6/12
代理机构 代理人
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