发明名称 Rough (high surface area) electrode from Ti and TiN, capacitors and semiconductor devices including same
摘要 A technique for forming a high surface area electrode or storage node for a capacitor and devices formed thereby, including depositing a first layer of conductive material on a substrate, such that a discontinuous layer is formed. A second conductive material layer is deposited over the discontinuous first conductive material layer, such that the second conductive material layer grows or accumulates on the discontinuous first conductive material layer at a faster rate than on the exposed areas of the substrate in the discontinuous first conductive material layer to form a rough conductive material layer.
申请公布号 US6608343(B2) 申请公布日期 2003.08.19
申请号 US20010005850 申请日期 2001.12.05
申请人 MICRON TECHNOLOGY, INC. 发明人 DERDERIAN GARO J.;SANDHU GURTEJ S.
分类号 H01L21/02;H01L21/8242;(IPC1-7):H01L27/108 主分类号 H01L21/02
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