| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve production efficiency by preventing resin from leaking. <P>SOLUTION: A semiconductor device comprises a substrate 7 including a plurality of connection terminals 7e formed around a concave portion 7b and a plurality of bump lands 7h arranged around the connection terminals; a semiconductor chip 1 disposed in the concave portion 7b; a plurality of wires 4 for connecting a pad 1a of the semiconductor chip 1 and the connection terminals 7e of the substrate 7; a sealing section embedded in the concave portion 7b; and a plurality of ball electrodes provided on the bump lands 7h of the substrate 7. A dummy wiring 7i covered with a solder resist 7f is formed in a region between the plurality of the connection terminals 7e of the substrate 7 and the plurality of the bump lands 7h, whereby a gap between a mold surface 12d of an upper mold 12 and the surface of the substrate 7 upon clamping the molds is buried with the dummy wiring 7i and the solder resist 7f covering the former, so that sealing resin 8 upon injecting the resin can be prevented from leaking, and as a result production efficiency in molding can be improved. <P>COPYRIGHT: (C)2003,JPO |
