| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for well face down mounting an optical device having a stepwise difference on a surface opposite to a mounting substrate. <P>SOLUTION: The method for mounting the optical device comprises the steps of providing electrodes 127, 128 on the board 12 for placing the optical device 120 having the stepwise difference on the surface opposite to the mounting substrate 121; and forming an area ratio of the electrodes 127, 128 to solder patterns 124, 125 to different values at respective wiring electrodes when the electrodes 127, 128 are provided. The device 120 is mounted on the substrate 121 by melting the solder so that a height of the solder is at least controlled by melting the solder, and the face down mounting of the device 120 having the stepwise difference on the surface opposite to the substrate 121 can be well realized. On the substrate 121, an amount of the solder is previously adjusted according to whether the properties of the solder in the region to be coated are initially low or high in wettability to the solder. <P>COPYRIGHT: (C)2003,JPO |
