| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board in which an inductance and resistance generated in a wiring path connecting an IC chip mounted on the wiring board and a capacitor are reduced. <P>SOLUTION: An IC connection terminal 155 and a capacitor connection terminal 139 of a wiring board 100 are connected by a short path of a wiring layer 153, a via conductor 146, a wiring layer 152, a via conductor 145, a wiring layer 151, a through hole conductor 112 and a wiring layer 119. Further, related to a capacitor 160 placed in a recessed part 135, a first capacitor via conductor 168b and a second capacitor via conductor 168c are placed like a lattice. Further the first capacitor via conductor 168b and the second capacitor via conductor 168c are alternately placed side-by-side. <P>COPYRIGHT: (C)2003,JPO</p> |
