| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling unit for efficiently dissipating heat released from an electronic device. SOLUTION: A frame 18 equipped with a heat receiving block 2, a fan mounting unit, and a heat pipe 5 is provided to the cooling unit 1 used for the electronic device 3. The heat receiving block 2 is formed of material whose thermal conductivity is higher than that of material forming the frame 18, heat dissipating fins 9 are arranged adjacent to an exhaust vent of the fan 12 mounted on the fan mounting unit, and the heat receiving block 2 and the heat dissipating fins 9 are linked together with the heat pipe 5 so as to transfer heat. COPYRIGHT: (C)2003,JPO |
