| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayered printed wiring board for semiconductor package that can cope with an increase in density of circuits and has sufficiently high reliability so as to reduce the size of a semiconductor package. SOLUTION: In this method, the muitilayered printed wiring board is manufactured by forming multiple layers by repeating circuit formation, after a photosensitive resin applied to copper foil is laminated upon a printed wiring board and electrically joining the circuits of different layers to each other through metallic bumps. The metallic bumps are formed by performing electroplating by using the copper foil as feeding layers. COPYRIGHT: (C)2003,JPO |
