发明名称 MULTILAYERED FLEXIBLE WIRING BOARD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a highly reliable multilayered flexible wiring board in which inter-layer connections can be achieved surely and external wiring boards can be laminated inexpensively upon an internal wiring board by easily getting positional accuracy. SOLUTION: This multilayered flexible wiring board is composed of external one- sided wiring boards and an internal flexible wiring board. Each external wiring board has a wiring pattern on one side of a supporting substrate composed of an insulating material, a two-layer conductor post 106 protruded from the wiring pattern to the other side of the substrate through the other surface of the substrate and composed of copper and solder and an adhesive layer having the function of a flux, adhered to the surface of the substrate from which the conductor post 106 is protruded. In addition, each external wiring board is cut into a piece having the size required for the multilayered section of the wiring board. The internal flexible wiring board is constituted of a wiring pattern having a pad 204 to be connected to the conductor post 106 on at least one side. This wiring board is constituted by sticking the external one-sided wiring boards to the internal flexible wiring board through the adhesive layers and soldering the conductor posts 106 to the pads 204 through the adhesive layers. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003229665(A) 申请公布日期 2003.08.15
申请号 JP20020023933 申请日期 2002.01.31
申请人 SUMITOMO BAKELITE CO LTD 发明人 NAKAO SATORU;OKA HIDEYUKI
分类号 H05K1/09;H05K1/02;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/09
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