| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board through which electronic parts mounted on its principal surface and chip capacitors mounted on its rear surface can be connected easily. <P>SOLUTION: In this wiring board 100, first solid conductor layers 126 are formed in the interlayer 136 between a core substrate 110 and a resin insulating layer 122 and first bumps 134b are connected to the first capacitor terminals 115b of the chip capacitors 113 through first via conductors 132b, the first solid conductor layers 126, and first through hole conductors 112b. In addition, second solid conductor layers 127 are formed in the interface 137 between the insulating resin layer 122, and another insulating resin layer 123 and second bumps 134 are connected to the second capacitor terminals 115c of the chip capacitors 113 through second via conductors 132c, the second solid conductor layers 127, second capacitor-side via conductors 131, and second through hole conductors 112c. <P>COPYRIGHT: (C)2003,JPO</p> |
