| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink device which is improved in mounting efficiency and capable of surely bringing a chip into close contact with a heat sink and protecting the chip or a socket terminal against damage. SOLUTION: The heat sink device includes a mother board main body, a socket, the chip, the heat sink, a back board, and bolts as main components. The socket is provided to the mother board main body, a recess where the chip is mounted is provided at the center of the top surface of the socket, an edge is provided around the recess, the top surface of the edge is made to serve as a pressure receiving surface, a vertical height difference between the pressure receiving surface and the bottom of the recess is equal to or larger than the thickness of the chip. A plurality of corresponding through-holes are provided to the board of the heat sink, the mother board main body, and the back board, and the heat sink board, the mother board main body, and the back board are fixed into one piece with the bolts. COPYRIGHT: (C)2003,JPO |
